DESIGN & BUILD
THE COOLING REVOLUTION
Traditional air cooling fails when GPU clusters generate heat equivalent to powering 40 homes per rack. Direct-to-chip liquid cooling and immersion technologies now achieve 30-40 % efficiency gains whilst enabling the extreme power den
Custom silicon allows hyperscale operators to reduce their dependence on traditional semiconductor suppliers whilst optimising power consumption for their specific use cases. This vertical integration provides both cost advantages and strategic control over their technology stack.
Network architecture transformation The shift to AI workloads has necessitated a complete rethink of data centre networking. Traditional threetier network architectures, designed for north-south traffic patterns between clients and servers, struggle with the east-west communication patterns that dominate AI training workloads.
Spine-leaf topologies have emerged as the dominant architecture for hyperscale facilities. This two-layer design connects every leaf switch( connected to servers) to every spine switch, ensuring that any server can communicate with any other server through a maximum of three network hops. This architecture provides predictable latency and can scale horizontally by adding more spine switches.
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