Vertiv industrialises liquid cooling for AI density rather than presenting it as a specialist add-on. Its CoolChip CDU 2300 extends the company’ s endto-end thermal chain and delivers 2.3MW of liquid-to-liquid cooling in a compact footprint, a configuration aimed at hyperscale and colocation environments where floor space and service access are tightly managed.
That CDU is now being positioned alongside specialised CoolChip Fluid Network Row Manifolds, which form the physical connectivity layer between the coolant distribution units, server-level cooling hardware and heat rejection systems. The importance of that design is practical: high-density liquid cooling only becomes mainstream when it can be deployed without forcing a redesign of the broader mechanical layout, and Vertiv’ s manifold and CDU family are clearly built around that requirement.
The company’ s recent EMEA expansion also suggests that supply availability is becoming part of the value proposition, not just product performance.
For operators planning AI clusters, Vertiv pairs thermal capacity with regional readiness, which is at the heart of its project delivery.
96 July 2026