Vertiv CoolChip CDU 100 addresses power density challenge The infrastructure challenges facing teams are multifaceted. Power density remains the primary concern, with the move from traditional 10-20kW racks to systems consuming up to 120-132kW or more today, and next-generation architectures targeting 600kW per rack by 2027.
“ This creates a cascade of technical challenges. Power delivery requires 33kW DC power shelves and 1400A busbars – infrastructure that was not required or imagined for pre-AI traditional data centres,” Andrea says.
“ Thermal management demands advanced liquid cooling systems like our Vertiv CoolChip CDU 100, capable of handling heat loads that would overwhelm conventional air cooling.”
But, Andrea notes, there is an additional complexity to consider: network sprawl.
“ Infrastructure teams now manage distributed AI workloads across potentially hundreds of edge locations, each requiring remote monitoring and management capabilities,” he says.“ Unlike centralised data centres with on-site technical teams, edge deployments often operate with minimal local support.
“ The integration challenge is equally significant. Modern AI infrastructure requires seamless coordination between compute racks, power distribution, cooling systems and monitoring. A failure in any single component can cascade through the entire system, making holistic design critical.”
30 December 2025